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Arrives by 21 September (Monday)
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Aerocool Cog 2g heat sink compound Thermal paste 8.5 W/m·K
incl. VAT: R714
R621
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Key features
- Resealable storage bag for convenient usage and storage
- Highly durable for long-lasting use of up to 8 years
- High viscosity allows for easy application
- Nanotechnology improves heat conduction
- Non-electric conductive materials ensure safe usage
- Low evaporation point and high temperature tolerance
- Spreader allows for quick and easy application
- Comes with 2 grams of thermal paste
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High-performance thermal paste specially designed for overclocking or gaming PCs. Comes with 2g thermal paste that’s easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, this thermal paste is completely safe to use. Comes with a spreader for quick and easy application.
HIGHLY EFFICIENT
Cog is a high performance thermal paste. It enhances the efficiency of the heat conduction, so you can game for hours without worrying about overheating your CPU.
EASY TO APPLY
Thanks to its viscosity, Cog thermal paste is easy to apply and allows perfect filling between your cooler and CPU. Low evaporation point and high temperature tolerance allow this paste to last a lifetime.
COMPLETELY SAFE
Made with non-electric conductive material. The thermal paste is completely safe and the nanotechnology in the paste improves heat conduction via its micro molecules.
HIGHLY EFFICIENT
Cog is a high performance thermal paste. It enhances the efficiency of the heat conduction, so you can game for hours without worrying about overheating your CPU.
EASY TO APPLY
Thanks to its viscosity, Cog thermal paste is easy to apply and allows perfect filling between your cooler and CPU. Low evaporation point and high temperature tolerance allow this paste to last a lifetime.
COMPLETELY SAFE
Made with non-electric conductive material. The thermal paste is completely safe and the nanotechnology in the paste improves heat conduction via its micro molecules.
| Specifications | |
| Warehouse group | CPUs [+1][-0] |
| Features | |
| Type | Thermal paste |
| Thermal conductivity | 8.5 W/m·K |
| Constitutive ingredients | Carbon, Metal oxide, Silicone |
| Viscosity note | 1000 cps |
| Specific gravity | 3.25 g/cm³ |
| Operating temperature (T-T) | -30 - 280 °C |
| Weight & dimensions | |
| Weight | 2 g |
| Packaging data | |
| Quantity per pack | 1 pc(s) |
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