Samsung 4GB DDR3 1333MHz Unbuffered SODIMM memory module 1 x 4 GB 204-pin SO-DIMM – photo 1
Out of Stock / Please Enquire ETA
SAMSUNG

Samsung 4GB DDR3 1333MHz Unbuffered SODIMM memory module 1 x 4 GB 204-pin SO-DIMM

R491
incl. VAT: R565
  • Stock: Out of Stock / Please Enquire ETA
  • Brand: SAMSUNG
  • Model: M471B5273CH0-CH9
  • Weight: 1 kg
  • Product code: 13052
Please Inquire
R491 incl. VAT: R565
We will email you when the product is back in stock.
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Key features

  • Laptop 4 GB DDR3
  • 204-pin SO-DIMM 1 x 4 GB
  • CAS latency: 9
  • 1.5 V

Description

First in the Market with Advanced DDR3.

Double Data Rate Three, Synchronous DRAM, or DDR3, is the new generation of high performance, ultra-low-power memory interface technology used in high performance servers, desktops and notebooks. As the number one supplier in memory, Samsung continues to lead the industry with cutting-edge SDRAM products from the first DDR in 1997, DDR2 in 2001 and DDR3 in 2005. Samsung's high performance main memory solutions are based on JEDEC standards and leverage the company's leadership in advanced research and development of semiconductor process technology.

Samsung's DDR3 brings new levels of performance to notebooks, desktops and servers and pushes the envelope in key areas like power consumption, speed and bandwidth. Our recent 30nm class, 1.35V, 2Gb DDR3 is the world's first ultra-low-power memory technology, with more than a 76% power savings over traditional DDR2 at 2x the bandwidth. When you're ready to make a move to DDR3 or are considering upgrading your systems, we're here to provide the best optimal solution for enhancing your competitive edge.

Specifications

Features
Internal memory 4 GB
Memory layout (modules x size) 1 x 4 GB
Internal memory type DDR3
Component for Laptop
Memory form factor 204-pin SO-DIMM
ECC No
CAS latency 9
Memory clock speed 1333 MHz
Buffered memory type Unregistered (unbuffered)
Memory voltage 1.5 V
Operational conditions
Operating temperature (T-T) 0 - 85 °C
Weight & dimensions
Width 67.6 mm
Height 30 mm
Other features
Chips organisation 512Mx64
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